ASU and Deca Technologies Unite for Groundbreaking Semiconductor Research

Arizona State University partners with Deca Technologies to establish North America’s first Fan-Out Wafer-Level Packaging research facility, aiming to enhance semiconductor manufacturing capabilities and foster innovation across multiple tech domains …

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Top 10 Army Technological Advances of 2020: Science Meets Soldier Safety

In 2020, Army researchers unveiled ten groundbreaking technological advancements aimed at improving Soldier safety and effectiveness. Highlights include intelligent munitions capable of hitting moving targets, 3D-printed munitions, AI for predicting …

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