Arizona State University partners with Deca Technologies to establish North America’s first Fan-Out Wafer-Level Packaging research facility, aiming to enhance semiconductor manufacturing capabilities and foster innovation across multiple tech domains including AI and computing. This initiative is part of a broader effort aligned with the CHIPS and Science Act to bolster the U.S. semiconductor industry and address workforce development in this critical sector.
In a transformative leap towards unprecedented innovation in semiconductor technology, Arizona State University (ASU) has joined forces with Deca Technologies, a frontrunner in advanced wafer- and panel-level packaging. Their collaboration, unveiled recently, aims to establish North America’s pioneering Fan-Out Wafer-Level Packaging (FOWLP) research and development facility, aptly named the Center for Advanced Wafer-Level Packaging Applications and Development. This center is positioned to invigorate the semiconductor landscape by enhancing domestic manufacturing capabilities critical for the booming fields of artificial intelligence, machine learning, automotive electronics, and high-performance computing. The innovative spirit of ASU, combined with Deca’s cutting-edge technologies, will create a hub for excellence, merging state-of-the-art packaging technology, processes, and training. This unprecedented venture is part of ASU’s Southwest Advanced Prototyping (SWAP) Hub, which operates under the broader Microelectronics Commons initiative. This network addresses the objectives set forth by the Department of Defense’s CHIPS and Science Act, which recognizes the pivotal role of advanced packaging in sustaining America’s global dominance in microelectronics by allocating $3 billion towards a National Advanced Packaging Manufacturing Program. Through this partnership, ASU aims to surge ahead in advanced packaging, a critical component in semiconductor manufacturing that streamlines processes by integrating components from multiple wafers into compact solutions. With over two decades since the introduction of advanced packaging concepts, their significance is now monumental, heralding a new era of efficiency and capability that captivates the industry. With aspirations to enrich both research endeavors and workforce development, ASU, supported by Deca, plans to cultivate a pool of local talent equipped to meet the demands of this evolving sector. This entails setting up extensive facilities capable of handling both 200mm and 300mm wafer formats, thereby ensuring broad application flexibility. Tim Olson, Deca’s founder and CEO, remarked, “With the industry’s leading fan-out technology as a foundation, we’re excited about the possibilities this new center brings to Arizona as well as the broader U.S. semiconductor industry.” The collaboration not only promises to propel innovation but also enhances collaborations among academia, government, and industry, fostering a synergistic environment where the future of technology can flourish.
Moore’s Law, established by Intel co-founder Gordon Moore in 1965, has long served as a guideline for the advancement of semiconductor technology, stating that the number of transistors on microchips doubles approximately every two years. This principle has catalyzed miniaturization and cost reduction in computing technology. However, as digital devices continue to reach new heights of complexity and capability, the fundamentals behind Moore’s Law face significant challenges, particularly under the weight of burgeoning fields like artificial intelligence and big data. In response to the need for innovation and to retain global leadership in semiconductor manufacturing, the U.S. is investing heavily in advanced packaging technologies which enable more efficient integration of components, a field in which ASU is now at the forefront through its collaboration with Deca Technologies.
The partnership between ASU and Deca represents a significant milestone in the realm of semiconductor innovation, heralding the establishment of an advanced packaging research center that promises to accelerate technological advancements. By harnessing state-of-the-art methodologies and fostering local talent, they are not only addressing the pressing needs of the industry but also reinforcing America’s position as a leader in microelectronics. Together, they are poised to shape the future of electronic device manufacturing and cultivate a thriving ecosystem for innovation.
Original Source: news.asu.edu
